Category Archives: New Technologies

Another IoT Platform - WICED

Broadcom is also jumping on the IoT wagon with the WICED  platform.  The platform is targeting Bluetooth and WiFi applications. The WiFi modules feature the BCM43362 WiFi chip integrated into a System in a Package (SiP) module. The Image below shows a WiFI WICED PCB module with a Murata WiFi SiP Module and a STM32F205 microcontroller. Murata also offers SiP modules that have the ARM microcontroller built in.

wiced_BCM943362WCD4

On the software side the platform is supported by a feature rich SDK and support for OSs:

  • WICED Application Framework including bootloader, flash storage API, over-the-air (OTA) upgrades, factory reset, and system monitor.
  • An open source build system and toolchain based on GNU make (native IAR support coming soon!).
  • A GUI Development Environment based on Eclipse CDT that seamlessly integrates with a JTAG programmer and single-step, thread-aware debugger based on OpenOCD and gdb.
  • A software stack with a choice of several RTOS/TCP stack options including ThreadX/NetXThreadX/NetX Duo and FreeRTOS/LwIP.
  • Support for security and networking features such as SSL/TLS, IPv4/IPv6 networking, and mDNS (Bonjour) device discovery.
  • Simple out-of-box device setup using Apple-licensed MFi technology or via a web browser and softAP/web server.

Broadcom also make a set of software examples available that help getting started quickly:

  • Production ready sample applications.
  • Lots of application snippets demonstrating how to use the rich WICED API feature set.
  • Various test applications to aid manufacturing and certification.
  • All documentation included inside the WICED SDK.

The next Electric Imp

Yesterday evening Hugo Fiennes, CEO and Co-founder of Electric Imp gave a talk at the Mountain View Hacker Dojo.

Hugo did a great job explaining the Electric Imp platform to a packed room. Besides a M&M candy dispenser that he controlled over the internet he also brought a board with the next generation Electric Imp on it.

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The Electric Imp is the silver module on the left. The tiny size gives an idea of how small of a form factor internet connectivity will be available. Hugo also shared his excitement about the reduction in power consumption and the ability to power IoT devices from batteries.

Is 3D Vision ready for prime time?

One of the exiting fields of embedded computing is 3D vision. The Microsoft's Kinect is certainly the premier consumer product in this category. However, if things go according to Intel's CEO Krzanich Kinect will soon get company. At his CES 2014 presentation he showed off RealSense scanning and gesture control technologies and announced the roll-out of this technology during 2014 with SDK becoming available soon.

Intel is not alone looking at this space. TI is also active in 3D Vision. However, their focus is more on Automotive rather than consumer devices.  For those interested to look behind the scene of 3D technology, there is a video interview by Jeff Bier, founder of the Embedded Vision Alliance, that presents some live 3D feeds and explanations by Goksel Dedeoglu, Manager of Embedded Vision R&D at Texas Instruments.

Combining 3D Vision with Infra-Red (IR) imaging technology as showcased in the video below and it is easy to imagine what exiting opportunities are out there.

I agree  that some of these technologies are out of reach for a typical DIY Maker. However, as in the past these technologies will come down in their price points and get more accessible to the masses quickly. One 3D Photo/Movie example can be found in Make Magazin. So it is never too early to start imagine what to do with it.